TD62604PG/fg 2009-11-24 1 toshiba bipolar digital integrat ed circuit silicon monolithic TD62604PG,td62604fg 6ch threshold free driver non-inverter/open collector the TD62604PG and td62604fg are threshold free drivers which are comprised of six npn transistor output stages and comparator input stages. the TD62604PG and td62604fg are pin compatible with cmos 4050b type except v ref terminal. v ref is set at 1/2 v cc with internal resistors and it is changeable using external resistors. applications include relay, hammer, lamp and display (led) drivers. features z wide supply voltage range v cc = 4 to 18 v z v ref = 1/2 v cc @16 pin is non-connected z pin compatible with cmos logic 4050b type open-collector. z package type-pg: dip-16 pin z package type-fg: sop-16 pin pin connection (top view) TD62604PG td62604fg weight dip16-p-300-2.54a : 1.11 g (typ.) sop16-p-225-1.27 : 0.16 g (typ.) 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 v ref o6 i6 nc o5 i5 o4 i4 v cc o1 i1 o2 i2 o3 i3 gnd
TD62604PG/fg 2009-11-24 2 schematics (each driver) note: the output parasitic diodes cannot be used as clamp diodes. absolute maximum ratings (ta = 25 c) characteristics symbol rating unit supply voltage v cc 20 v output sustaining voltage v out ? 0.5 to 20 v output current i out 10 ma/ch input voltage v in ?0.5 to v cc + 0.5 v pg 1.0 power dissipation fg p d (note 2) 0.625 (note 1) w operating temperature t opr ?40 to 85 c storage temperature t stg ?55 to 150 c note 1: on pcb (30 30 1.6 mm cu 50%) note 2: derated above 25c in the proportion of 8.0 mw/c (pg type), 5.0 mw/c (fg type). operating ranges (ta = ? 40 to 85 c) characteristics symbol condition min typ. max unit supply voltage v cc ? 4.0 ? 18 v output sustaining voltage v out ? 0 ? 18 v output current i out v cc = 5 v 0 ? 8 ma/ch input voltage v in ? 0 ? v cc v ref, input voltage v ref ta = 25c 0.4 ? v cc - 1.6 v pg ? ? ? 0.36 power dissipation fg p d on pcb ? ? 0.325 w v re f input r r v cc output gnd
TD62604PG/fg 2009-11-24 3 electrical characteristics (ta = 25 c) characteristics symbol test circuit test condition min typ. max unit high level v ih ? ? v ref + 0.1 ? ? input voltage low level v il ? ? ? ? v ref ? 0.1 v output current high level i oh ? v cc = 4.5 v, v o = 18 v ? ? 10 a output voltage low level v ol ? v cc = 4.5 v, i o = 8 ma ? 0.1 0.4 v high level i ih ? ? ? ? 2 input current low level i il ? ? ? ?0.2 ?1.5 a v ref terminal voltage v ref (out) ? ? 1/2 v cc 0.1 ? 1/2 v cc + 0.1 v v ref resistor r ref ? ? 3.5 5 6.5 k supply current i cc ? ? ? ? 12 ma turn-on delay t on ? ? 0.5 ? s turn-off delay t off ? v cc = 5 v, v out = 18 v r l = 2 k ? 0.2 ? s precautions for using this ic does not integrate protection circuits such as overcurrent and overvoltage protectors. thus, if excess current or voltage is applied to the ic, the ic may be damaged. please design the ic so that excess current or voltage will not be applied to the ic. utmost care is necessary in th e design of the output line, v cc and gnd line since ic may be destroyed due to short-circuit between outputs, air contaminatio n fault, or fault by improper grounding.
TD62604PG/fg 2009-11-24 4 package dimensions weight: 1.11 g (typ.)
TD62604PG/fg 2009-11-24 5 package dimensions weight: 0.16 g (typ.)
TD62604PG/fg 2009-11-24 6 notes on contents equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum rating s, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large curren t to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negati ve current resulting from the back electromotive force at power off. ic breakdown may cause in jury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative term inals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can ca use smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly.
TD62604PG/fg 2009-11-24 7 points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat ev en during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, dete rioration of ic characterist ics or ic breakdown. in addition, please design the device taking into co nsiderate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply an d output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design. about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux
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and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, in cluding but not limited to (a) determining the appropriateness of the use of this p roduct in such design or applications; (b) evaluati ng and determining the applicability of any in formation contained in this document, or in charts, diagrams, programs, algorithms, sa mple application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devi ces, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. do not use product for unintended use unless specifica lly permitted in this document. ? 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